Keyphrases
Pseudogap
72%
Mechanical Properties
71%
Multilayer Film
60%
Bilayer Thickness
51%
Pseudogap Phenomena
43%
Tribological Properties
41%
X-ray Photoelectron Spectroscopy
40%
Atomic Force Microscopy
40%
Sn Doping
39%
Nanostructures
37%
Superconducting Gap
37%
Cuprate Superconductors
37%
Gap Opening
37%
Cr2N
37%
Sputter-deposited
37%
Root Mean Square
34%
Closed Field Unbalanced Magnetron Sputtering (CFUBMS)
34%
Pin-on-disc Test
34%
TiAlN
34%
Substrate Rotation
32%
CNx Film
32%
High-temperature Superconductors
32%
Spin Pairing
32%
X Ray Diffraction
32%
Si(111)
32%
Nanohardness
30%
Si-C
30%
Carbon Nitride
29%
Target Current
28%
Surface Roughness
28%
Structural Properties
27%
High-Tc Cuprate Superconductor
27%
Thermal Stability
27%
Mechanical Alloying
27%
Scratch Test
27%
In Situ
23%
Hg-1223
23%
Friction Coefficient
23%
Layer Thickness
22%
Nanoindentation Measurement
21%
Mercury
21%
YBCO Superconductor
21%
TiN Layer
21%
Titanium Aluminides
20%
M42 High Speed Steel
19%
High-speed Steel Substrate
19%
Chemical State
19%
Si (100) Substrate
18%
Phase Synthesis
18%
Phase Evolution
18%
Material Science
Film
100%
Superconducting Material
83%
Magnetron Sputtering
72%
Multilayer Film
65%
Cuprate
65%
Carbon Nitride
38%
High Temperature Superconductors
37%
Powder
37%
X-Ray Diffraction
35%
Electrical Resistivity
27%
Thermal Stability
27%
Mechanical Alloying
27%
X-Ray Photoelectron Spectroscopy
24%
Surface Roughness
24%
Thin Films
22%
Nanohardness
21%
Titanium Aluminide
19%
High Speed Steel
19%
Nanoindentation
18%
Semiconductor Doping
18%
Nanocomposites
18%
Aluminum
18%
Titanium Dioxide
18%
Microhardness
17%
Mechanical Strength
16%
Chemical State
14%
Magnesium
13%
Transmission Electron Microscopy
11%
Coefficient of Friction
10%
Carbide
9%
Silicide
9%
Structural Property
9%
Oxide Compound
9%
Elastic Moduli
9%
Density
9%
Titanium
9%
Ceramic Superconductors
9%
Conductor
9%
Phase Structure
9%
Young's Modulus
9%
Amorphous Material
8%
Scanning Electron Microscopy
8%
Hot Isostatic Pressing
6%
Alloying
6%
Single Crystal
6%
Solid Solution
6%
Engineering
Magnetron
58%
Multilayer Film
55%
Superconductor
46%
Ray Diffraction
45%
Layer Thickness
37%
Transmissions
30%
Atomic Force Microscopy
30%
Root Mean Square
27%
Nitride
27%
Rockwell C
27%
Mechanical Alloying
27%
Rotation Speed
24%
High-Speed Steel
23%
Deposition Process
21%
Ray Photoelectron Spectroscopy
21%
Solid Solution
19%
Powder Mixture
19%
Phase Stability
18%
Microstructure
18%
Nanohardness
18%
Room Temperature
16%
Elevated Temperature
16%
Microhardness
15%
Thin Films
13%
Hot Isostatic Pressing
13%
Semiconductor Doping
12%
Nanocrystalline
12%
Friction Coefficient
12%
Compressive Stress
12%
Internals
12%
Dry Condition
12%
Pin-on-Disc
12%
C/N Ratio
9%
Pin-on-Disk Wear Test
9%
Closed Loop
9%
Compressive Residual Stress
9%
Substrate Bias
9%
Phase Formation
9%
Phase Structure
9%
Coefficient of Friction
9%
Nanoscale
9%
Cohesive Strength
9%
Root Mean Square Value
9%
Bias Voltage
9%
Rotation Rate
9%
Thermal Excitation
9%
Structure Type
9%
Crystal Structure
9%
Photoelectron
9%
Indentation
9%
