An optimum spacing problem for five chips on a horizontal substrate in a vertically insulated enclosure

Y. Liu, N. Phan-Thien, C. W. Leung, T. L. Chan

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

The optimum spacing problem for five heated chips rested on a conductive substrate in a vertically insulated enclosure filled with air is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. The maximum relative temperature drop in the optimum configuration can be as much as 20% of the equi-spaced arrangement.

Original languageEnglish
Pages (from-to)310-317
Number of pages8
JournalComputational Mechanics
Volume24
Issue number4
DOIs
Publication statusPublished - 1999

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