Carbon nitride based hard multilayer films prepared by closed field unbalanced magnetron sputtering

Keyphrases

• Adhesion 50%
• Atomic Force Microscopy 100%
• Bilayer Period 50%
• Bilayer Thickness 50%
• Bonding State 50%
• C-ratio 50%
• C-test 50%
• Carbon Nitride 100%
• Chemical State 50%
• Closed Field Unbalanced Magnetron Sputtering (CFUBMS) 100%
• CNx Film 100%
• Compressive Stress 50%
• Deposition Process 50%
• Drying Conditions 50%
• High-speed Steel Substrate 50%
• Layer Thickness 50%
• Low Friction Coefficient 50%
• M42 High Speed Steel 50%
• Mechanical Properties 50%
• Microhardness 50%
• Microindentation 50%
• Multilayer Film 100%
• Multilayered Structure 50%
• Nanohardness 50%
• Pin-on-disc Test 100%
• Root Mean Square 50%
• Rutile 50%
• Scratch Test 50%
• Scratch Tester 50%
• Si(111) 50%
• Sp3 Bonds 50%
• Substrate Rotation 100%
• Surface Roughness 50%
• Ta-CNx 50%
• Target Current 100%
• TiN Layer 50%
• Transmission Electron Microscopy 50%
• Tribological Properties 50%
• X-ray Photoelectron Spectroscopy 100%

Engineering

• Atomic Force Microscopy 100%
• C/N Ratio 50%
• Compressive Stress 50%
• Deposition Process 50%
• Dry Condition 50%
• Friction Coefficient 50%
• High-Speed Steel 50%
• Internals 50%
• Layer Thickness 50%
• Magnetron 100%
• Microhardness 50%
• Multilayer Film 100%
• Nanohardness 50%
• Nitride 100%
• Pin-on-Disc 50%
• Pin-on-Disk Wear Test 50%
• Ray Photoelectron Spectroscopy 100%
• Rockwell C 100%
• Root Mean Square 50%
• Rotation Speed 100%
• Transmissions 50%

Material Science

• Carbon Nitride 100%
• Film 100%
• High Speed Steel 25%
• Magnetron Sputtering 100%
• Microhardness 50%
• Multilayer Film 100%
• Nanohardness 25%
• Surface Roughness 25%
• Titanium Dioxide 25%
• Transmission Electron Microscopy 25%
• X-Ray Photoelectron Spectroscopy 50%