TY - GEN
T1 - Evaporation of silver-graphene hybrid nanofluid droplet on its nanostructured residue and plain copper surfaces at elevated temperatures
AU - Siddiqui, Farooq Riaz
AU - Tso, Chi Yan
AU - Fu, Sau Chung
AU - Qiu, Huihe
AU - Yu, Christopher
AU - Chao, Hang
N1 - Publisher Copyright:
© 2020 ASME
PY - 2020
Y1 - 2020
N2 - Droplet evaporation is an efficient process as it removes a large amount of heat by using the latent energy, making it suitable for heat transfer applications. In this research, evaporation of the silver-graphene hybrid nanofluid (SGHF) droplet, because of its synergistic thermal conductivity, is investigated for substrate temperature in a range of 25-100 °C. The experiments for droplet evaporation were performed in an environmental facility for two droplet sizes, 3 µL and 30 µL volume, on a copper plate. A 100 W silicone heater mat was used to heat the copper plate from the underside, while two T-type thermocouples were used to monitor its surface temperature. As droplet evaporation ended, a porous residue was formed on the copper surface. Subsequently, a 3 µL volume of the SGHF droplet was dispensed on the porous residue surface. The results showed a tremendous rise in the evaporation rate (up to 160%) for the subsequent SGHF droplet sitting on the porous residue as compared to the non-wetted copper surface. Moreover, the evaporation rate of the SGHF droplet on the copper surface increased up to 56% as compared to the water droplet for a substrate temperature range of 25-100 °C.
AB - Droplet evaporation is an efficient process as it removes a large amount of heat by using the latent energy, making it suitable for heat transfer applications. In this research, evaporation of the silver-graphene hybrid nanofluid (SGHF) droplet, because of its synergistic thermal conductivity, is investigated for substrate temperature in a range of 25-100 °C. The experiments for droplet evaporation were performed in an environmental facility for two droplet sizes, 3 µL and 30 µL volume, on a copper plate. A 100 W silicone heater mat was used to heat the copper plate from the underside, while two T-type thermocouples were used to monitor its surface temperature. As droplet evaporation ended, a porous residue was formed on the copper surface. Subsequently, a 3 µL volume of the SGHF droplet was dispensed on the porous residue surface. The results showed a tremendous rise in the evaporation rate (up to 160%) for the subsequent SGHF droplet sitting on the porous residue as compared to the non-wetted copper surface. Moreover, the evaporation rate of the SGHF droplet on the copper surface increased up to 56% as compared to the water droplet for a substrate temperature range of 25-100 °C.
KW - Droplet evaporation
KW - Hybrid nanofluid
KW - Infrared imaging
KW - Marangoni convection
KW - Porous droplet residue
UR - https://www.scopus.com/pages/publications/85092629613
U2 - 10.1115/HT2020-8922
DO - 10.1115/HT2020-8922
M3 - Conference contribution
AN - SCOPUS:85092629613
T3 - ASME 2020 Heat Transfer Summer Conference, HT 2020, collocated with the ASME 2020 Fluids Engineering Division Summer Meeting and the ASME 2020 18th International Conference on Nanochannels, Microchannels, and Minichannels
BT - ASME 2020 Heat Transfer Summer Conference, HT 2020, collocated with the ASME 2020 Fluids Engineering Division Summer Meeting and the ASME 2020 18th International Conference on Nanochannels, Microchannels, and Minichannels
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2020 Heat Transfer Summer Conference, HT 2020, collocated with the ASME 2020 Fluids Engineering Division Summer Meeting and the ASME 2020 18th International Conference on Nanochannels, Microchannels, and Minichannels
Y2 - 13 July 2020 through 15 July 2020
ER -