Forced convective air-cooling of simulated printed-circuit boards

W. C. Tam, C. W. Leung, S. D. Probert

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars-hereafter referred to as ribs, used to mimic the behaviour of electronic components-protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is Nuc=1·4×10- Re9·88c for 8·5 × 102 ≤ Rec ≤ 3·5 × 104.

Original languageEnglish
Pages (from-to)197-214
Number of pages18
JournalApplied Energy
Issue number3
Publication statusPublished - 1993


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