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Natural-convection cooling of a housed, simulated printed-circuit board
K. F. Chan
,
C. W. Leung
, S. D. Probert
School of Professional Education and Executive Development (SPEED)
Research output
:
Contribution to journal
›
Article
›
peer-review
2
Citations (Scopus)
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Keyphrases
Printed Circuit Board
100%
Natural Convection Cooling
100%
Heat Dissipation
25%
Natural Convection
12%
Steady-state Rate
12%
Marginal Effects
12%
Electronic Components
12%
Cooling Air
12%
Geometric Parameters
12%
Exact Positions
12%
Near-wall
12%
Steady-state Temperature
12%
Heat Transfer Behavior
12%
Vertical Height
12%
Vertical Surface
12%
Ventilation Hole
12%
High Temperature
12%
Rapid Failure
12%
Engineering
Natural Convection
100%
Printed Circuit Board
100%
Heat Losses
25%
Marginals
12%
State Rate
12%
Cooling Air
12%
Geometric Parameter
12%
State Temperature
12%
Material Science
Electronic Circuit
100%
Natural Convection
100%
Electronic Component
12%
Chemical Engineering
Natural Convection
100%