Keyphrases
Si (100) Substrate
100%
Bilayer Thickness
100%
Surface Roughness
75%
Root Mean Square
75%
Microhardness
50%
Substrate Rotation
50%
X Ray Diffraction
25%
Chemical State
25%
Transmission Electron Microscopy
25%
Rutile
25%
X-ray Photoelectron Spectroscopy
25%
Pin-on-disc Test
25%
Atomic Force Microscopy
25%
Drying Conditions
25%
Compressive Stress
25%
Closed Field Unbalanced Magnetron Sputtering (CFUBMS)
25%
Deposition Process
25%
Maximum Hardness
25%
TiN Layer
25%
Magnetron Sputtering Deposition
25%
Low Friction Coefficient
25%
Multilayer Structure
25%
Bonding State
25%
High Angle
25%
Multilayer Coatings
25%
Diffraction Angle
25%
Stress Measurement
25%
Bonding Structure
25%
Low Angle X-ray Scattering
25%
Engineering
Root Mean Square
100%
Rotation Speed
66%
Microhardness
66%
Internals
33%
Transmissions
33%
Ray Diffraction
33%
Magnetron
33%
Compressive Stress
33%
Layer Structure
33%
Friction Coefficient
33%
Ray Photoelectron Spectroscopy
33%
Multilayer Coating
33%
Atomic Force Microscopy
33%
Pin-on-Disc
33%
Deposition Process
33%
Dry Condition
33%
Material Science
Surface Roughness
100%
Microhardness
66%
X-Ray Diffraction
33%
Transmission Electron Microscopy
33%
Chemical State
33%
Magnetron Sputtering
33%
X-Ray Photoelectron Spectroscopy
33%
Titanium Dioxide
33%
Stress Measurement
33%
Laminate
33%